Senior Power SiP & Flip-Chip Package Designer

Renesas; Tempe (AZ); On-site; USD 120,000 - 190,000; Full time

Job summary

Renesas Electronics is seeking an experienced packaging engineer in Tempe, AZ to design and develop advanced power SiP/module and flip-chip interconnect technologies. You will lead qualification programs, select materials, and coordinate with OSAT/CM partners to meet schedule and quality targets.

You will work closely with Product and Reliability teams to validate new packages, establish process specs, and drive ramp‑up confidently while solving production-integration challenges across

Qualifications

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.

Responsibilities

• Design and develop package and interconnect methods for Renesas’s packaging needs in Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging.
• Package technologies qualification for consumer & industrial power as well as automotive power applications.
• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
• Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
• Resolve all process integration issues by ensuring all window checks are done on critical process steps.
• Establish production controls and monitor to ensure there is no room for quality incidents.
• Ensure smooth transition into production & implement ramp up monitor.
• Work with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer.
• Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA.
• Participate in packaging roadmap development & focus on execution.
• Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.

Skills

Power packaging knowledge

Interpersonal & communication skills

Analytical & presentation skills

Education

Doctorate/Masters/Bachelor’s in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

Job description

Renesas Electronics is seeking an experienced packaging engineer in Tempe, AZ to design and develop advanced power SiP/module and flip-chip interconnect technologies. You will lead qualification programs, select materials, and coordinate with OSAT/CM partners to meet schedule and quality targets.

You will work closely with Product and Reliability teams to validate new packages, establish process specs, and drive ramp‑up confidently while solving production-integration challenges across