Power Packaging Design & NPI Lead

SmartRecruiters, Inc.; Tempe (AZ); On-site; USD 150,000 - 210,000; Full time

Job summary

Renesas Electronics is seeking a senior leader to drive package technology development for AI and data center power products. You will coordinate with OSATs for new package development, qualification, and production transfer, while managing budgets and customer adoption programs.

The role requires extensive experience in power SiP/modules, wafer-level packaging, flip-chip methods, and advanced substrates, with a track record in leading cross-functional teams and delivering on aggressive

Qualifications

• Master’s or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering, or related field.
• 12–15 years of semiconductor package development experience with leadership responsibilities.
• Strong knowledge of power SiP/modules, wafer-level and flip-chip packaging.

Responsibilities

• Lead package technology development and NPI execution with global OSAT partners.
• Manage design and development of power package solutions for AI and data center infrastructure.
• Coordinate DOE planning, supplier qualification, and process specification definition.
• Drive production-transfer readiness, ramp-up monitoring, and issue escalation.
• Lead cross-functional teams across product groups, quality, operations and supply chain.

Skills

Power packaging

Wafer-level packaging

DOE execution

Process optimization

Cross-functional leadership

Material qualification

Education

Master's or Bachelor's in Physics/Engineering

PhD a plus

Tools

SPC

DOE tools

Statistical analysis

Job description

Renesas Electronics is seeking a senior leader to drive package technology development for AI and data center power products. You will coordinate with OSATs for new package development, qualification, and production transfer, while managing budgets and customer adoption programs.

The role requires extensive experience in power SiP/modules, wafer-level packaging, flip-chip methods, and advanced substrates, with a track record in leading cross-functional teams and delivering on aggressive