Lead Power Package Design Engineer (SiP/Flip-Chip)

Renesas Electronics Corp.; TX, US; In loco; USD 150.000 - 230.000; Tempo pieno

Descrizione del lavoro

Renesas Electronics Corp. in Wisconsin is seeking a senior package technology professional to lead R&D, NPIs, and OSAT management for advanced power packaging solutions.

You will focus on Smart Power Stages, Vertical Power Stages, Power Modules and Discrete FET packages, including SiC/GaN and other interconnects, with extensive DOE and process qualification. The role requires 15–20 years of experience and a PhD/MS/Bachelor in related field, and collaboration with product, reliability, quality to

Competenze

• PhD/MS/Bachelor in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 15–20 years of experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Mansioni

• Lead package technology development and qualification programs.
• Define roadmaps for power SiP/module packaging technologies.
• Collaborate with OSAT/CMs for DOE, process optimization, and specs.
• Ensure production transfer readiness and ramp-up monitoring.
• Address quality issues and drive continuous improvement.

Conoscenze

Power electronics

Interpersonal skills

Analytical skills

Presentation skills

Wire bonding

Wafer level packaging

Flip-chip packaging

Materials engineering knowledge

Formazione

PhD / MS / Bachelors in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

Strumenti

SPC software

Statistical analysis software

Descrizione del lavoro

Renesas Electronics Corp. in Wisconsin is seeking a senior package technology professional to lead R&D, NPIs, and OSAT management for advanced power packaging solutions.

You will focus on Smart Power Stages, Vertical Power Stages, Power Modules and Discrete FET packages, including SiC/GaN and other interconnects, with extensive DOE and process qualification. The role requires 15–20 years of experience and a PhD/MS/Bachelor in related field, and collaboration with product, reliability, quality to