Senior Power Package Design & NPI Leader

Renesas Electronics Corp.; Tempe (AZ); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Competitive benefits package

Job summary

Renesas Electronics Corp. is seeking a senior packaging technology leader to drive development and NPI for power package solutions.

You will lead cross-functional teams with global OSAT partners, implement roadmaps, and manage budgets while ensuring product qualification and customer adoption. You will oversee SiP/module and wafer-level packaging initiatives, coordinate DOE activities, and drive robust process validation and transfer to production across multiple product lines.

Qualifications

• 12–15 years of semiconductor package development experience.
• Experience leading cross-functional teams and global partnerships.
• Strong knowledge of power SiP/modules and wafer-level packaging.
• DOE planning and statistical analysis proficiency.

Responsibilities

• Lead package technology development and NPI execution with OSAT partners.
• Manage design and development of interconnect solutions for Renesas AI and data center infrastructure power products.
• Support SiC and GaN packaging development and advanced substrates.
• Qualify materials, processes, OSATs, and contract manufacturers.
• Coordinate with product groups to qualify new packages within schedules.
• Drive process integration issue resolution and risk assessment.
• Define production controls and corrective actions to improve robustness.
• Ensure smooth technology transfer and ramp-up readiness.
• Lead technical responses to customer concerns with cross-functional teams.
• Establish package design rules and engineering standards.

Skills

Cross-functional leadership

Project management

DOE planning

Analytical skills

Communication skills

Education

Master or PhD in Engineering

PhD preferred

Tools

DOE software

Statistical analysis tools

SPC

Job description

Renesas Electronics Corp. is seeking a senior packaging technology leader to drive development and NPI for power package solutions.

You will lead cross-functional teams with global OSAT partners, implement roadmaps, and manage budgets while ensuring product qualification and customer adoption. You will oversee SiP/module and wafer-level packaging initiatives, coordinate DOE activities, and drive robust process validation and transfer to production across multiple product lines.