Senior Power Packaging Engineer – SiP & WLP

Renesas Electronics Corporation; Tempe (AZ); On-site; USD 120,000 - 180,000; Full time

Job summary

Renesas Electronics Corporation in Tempe specializes in advanced power packaging solutions, including SiP/modules, flip-chip LGA, and multi-chip modules with substrates or embedded die/capacitors. The role focuses on designing interconnect methods, qualifying materials, and coordinating with OSAT/CM partners to ensure robust, scalable packaging for automotive, consumer, and industrial applications.

You will work with Product and Reliability teams to qualify new packages, implement DOE-driven

Qualifications

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
• Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software.
• Knowledge of Cu FSM/BGBM technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Responsibilities

• Design and develop package and interconnect methods for power SiP/modules and related packaging.
• Package technologies qualification for consumer & industrial power as well as automotive power applications.
• Benchmark, select and qualify materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Collaborate with OSAT/CM to run DOE for process optimization and establish process specs.
• Qualify new packages and processes with Product groups and Reliability team.
• Resolve process integration issues by ensuring window checks on critical steps.
• Establish production controls and monitor quality to prevent incidents.
• Ensure smooth transition into production and ramp-up monitoring.
• Monitor and resolve process issues with OSAT/CM during early production to ensure quality parts.
• Develop expertise on advances in power SiP/modules and wafer-level packaging.
• Participate in packaging roadmap development with execution focus.
• Address internal/external customer complaints with Marketing, Product, Quality, and Operations.
• Establish and maintain package design rules.

Skills

Interpersonal skills

Communication skills

Analytical skills

Presentation skills

Education

Degrees in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

Tools

SPC software

Cu FSM/BGBM technologies

Job description

Renesas Electronics Corporation in Tempe specializes in advanced power packaging solutions, including SiP/modules, flip-chip LGA, and multi-chip modules with substrates or embedded die/capacitors. The role focuses on designing interconnect methods, qualifying materials, and coordinating with OSAT/CM partners to ensure robust, scalable packaging for automotive, consumer, and industrial applications.

You will work with Product and Reliability teams to qualify new packages, implement DOE-driven