Senior Power Package Design Lead

Renesas Electronics Corp.; Arizona; On-site; USD 140,000 - 200,000; Full time

Job summary

Renesas Electronics Corp. seeks an experienced semiconductor packaging leader to drive technology development and NPI execution for power SiP/modules and high‑reliability interconnect solutions.

You will collaborate with OSATs, suppliers, and internal teams to meet schedule, cost, and quality targets. The role requires 12–15 years in package development, with a strong background in wafer‑level packaging, flip‑chip, and power packaging technologies.

Qualifications

• Demonstrated ability to lead cross-functional technical teams.
• Strong project management and presentation skills.
• Knowledge of power SiP/modules and advanced substrates is preferred.

Responsibilities

• Lead package technology development and NPI execution with global OSAT partners.
• Manage design and development of package and interconnect solutions for power products.
• Support SiC/GaN package development and advanced interconnect technologies.
• Evaluate materials and suppliers to meet quality, cost, and capacity targets.
• Coordinate with multiple groups to qualify new packages and processes on schedule.

Skills

Cross-functional leadership

Power/Package development

Wafer-level packaging

Lead NPI

Process qualification

Education

Master's or Bachelor's Degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, or Materials Engineering

Job description

Renesas Electronics Corp. seeks an experienced semiconductor packaging leader to drive technology development and NPI execution for power SiP/modules and high‑reliability interconnect solutions.

You will collaborate with OSATs, suppliers, and internal teams to meet schedule, cost, and quality targets. The role requires 12–15 years in package development, with a strong background in wafer‑level packaging, flip‑chip, and power packaging technologies.