Senior Manager, Power Package Design & NPI

Renesas Electronics Corporation; Tempe (AZ); On-site; USD 180,000 - 240,000; Full time

Job summary

Renesas Electronics in Tempe, AZ seeks a senior packaging leader to drive technology development and NPI for power SiP and interconnect solutions. You will coordinate with OSATs, subcontractors, and cross-functional teams to ensure on-time qualification and robust production transfer.

You will oversee SiC/GaN packaging activities and advanced substrates, while guiding DOE plans, risk assessments, and delivery against targets. A strong track record in power packaging is required.

Qualifications

• Master’s or Bachelor’s degree in a relevant engineering or science field; doctorate a plus.
• 12–15 years in semiconductor package development with leadership responsibility.

Responsibilities

• Lead package technology development and NPI execution with OSAT partners.
• Manage design and development of package/interconnect solutions for power products.
• Support wide-bandgap SiC/GaN package development and advanced interconnects.
• Evaluate materials, processes, and subcontractors to meet quality and cost targets.
• Plan DOEs with manufacturing partners; close technical gaps.
• Coordinate with cross-functional teams to qualify new packages on schedule.
• Drive risk assessment and robust process-window validation.
• Define production controls and corrective actions for robustness.
• Ensure smooth tech transfer to production and ramp-up readiness.
• Maintain packaging roadmaps and lead cross-functional deliverables.
• Lead technical responses to customer concerns with Marketing and Quality.
• Establish and maintain package design rules and standards.

Skills

Power SiP/modules

Wafer-level packaging

Flip-chip packaging

DOE / SPC / statistical analysis

Cross-functional leadership

Project management

Analytical problem solving

Communication skills

Education

Master's or Bachelor's in Physics, Chemistry, Mechanical/Electrical/Materials Engineering

Tools

Wire-bonding

SiC/GaN packaging

Job description

Renesas Electronics in Tempe, AZ seeks a senior packaging leader to drive technology development and NPI for power SiP and interconnect solutions. You will coordinate with OSATs, subcontractors, and cross-functional teams to ensure on-time qualification and robust production transfer.

You will oversee SiC/GaN packaging activities and advanced substrates, while guiding DOE plans, risk assessments, and delivery against targets. A strong track record in power packaging is required.