Head of Power Packaging & SiC/GaN Technology

Renesas Electronics Corp.; Austin (TX); On-site; USD 140,000 - 210,000; Full time

Job summary

Renesas Electronics Corp. is seeking an senior-level professional to lead Package Technology Development/NPI, R&D, and Global OSAT management for new package development and product qualification.

The role supports technology roadmaps and budgets while driving customer adoption programs. You will focus on design and development of package and interconnect methods for AI/datacenter infrastructure power packaging, including Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FETs.

Qualifications

• Doctorate/Masters/Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
• 15–20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
• Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
• Knowledge of wire-bonding & multi-chip module technologies a plus
• Strong interpersonal and communication skills
• Strong analytical and presentation skills

Responsibilities

• Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs
• Design and develop package and interconnect methods for AI/Datacenter infrastructure power packaging
• Benchmark, select and qualify materials, processes and OSAT/CM
• Collaborate with OSAT/CM to optimize processes and establish specs
• Work with Product groups and Reliability team to qualify new packages and processes
• Resolve process integration issues with window checks on critical steps
• Establish production controls and ramp-up monitoring
• Ensure quality and timely transition into production with OSAT/CM

Skills

Power SiP/modules

Wafer level packaging

Flip-chip packaging

SPC/Statistical analysis

Wire bonding

Communication skills

Education

Engineering degree (PhD / MS / BS) in Physics, Chemistry, Mechanical, Electrical or Materials

Tools

SPC software

Statistical analysis tools

Job description

Renesas Electronics Corp. is seeking an senior-level professional to lead Package Technology Development/NPI, R&D, and Global OSAT management for new package development and product qualification.

The role supports technology roadmaps and budgets while driving customer adoption programs. You will focus on design and development of package and interconnect methods for AI/datacenter infrastructure power packaging, including Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FETs.