Director, Power Packaging & SiP Innovation

Renesas Electronics Corp.; Dallas (TX); On-site; USD 180,000 - 260,000; Full time

Job summary

Renesas Electronics Corp. seeks a senior packaging leader to drive technology development for AI/datacenter power packaging, including Smart Power Stages and Power Modules.

You will guide interconnect solutions, participate in roadmap planning, and oversee budget and supplier relationships with OSATs and contract manufacturers. The role emphasizes wafer-level and flip-chip packaging knowledge, DOE-driven process optimization, and collaboration across product, reliability, quality, and operations

Qualifications

• PhD/ MSc or Bachelors in engineering with 15–20 years of packaging experience.
• Deep knowledge of power SiP/modules and wafer level/flip-chip packaging.
• Experience in selecting materials, processes and OSAT/CM coordination.

Responsibilities

• Lead package technology development, NPI, R&D and OSAT management for new package development and qualification.
• Define technology roadmaps and manage R&D budgets with customer adoption programs.
• Develop interconnect methods for smart power stages and power modules, including SiC/GaN work.
• Collaborate with product, reliability, quality and operations to qualify new packages.
• Drive DOE studies to optimize processes and set specifications.
• Establish production controls and ramp-up monitoring to avoid quality incidents.

Skills

Package development

Power SiP/modules

Wafer level packaging

Flip-chip interconnects

DOE optimization

Process control

OSAT/CM collaboration

Data-driven analysis

Education

PhD/Master’s/Bachelor in Physics, Chemistry, Mechanical, Electrical or Materials Eng

Tools

Statistical analysis software

Job description

Renesas Electronics Corp. seeks a senior packaging leader to drive technology development for AI/datacenter power packaging, including Smart Power Stages and Power Modules.

You will guide interconnect solutions, participate in roadmap planning, and oversee budget and supplier relationships with OSATs and contract manufacturers. The role emphasizes wafer-level and flip-chip packaging knowledge, DOE-driven process optimization, and collaboration across product, reliability, quality, and operations