Director, Power Packaging & SiP Innovation

Renesas Electronics Corp.; San Jose (CA); On-site; USD 230,000 - 260,000; Full time

Job summary

Renesas Electronics Corp. is seeking a senior Packaging Technology Development lead to drive new package development, qualification and technology roadmaps for AI/datacenter power packaging.

You will coordinate with OSAT/CM partners, Product, Reliability and Operations to ensure timely qualification and smooth production ramp. The role focuses on power SiP/modules, wafer-level and flip-chip packaging, DBC/AMB substrates and related interconnects.

Qualifications

• PhD/MS/Bachelor in physics, chemistry, mechanical, electrical or materials engineering.
• 15–20 years of experience in package development for power SiP/module.
• Strong understanding of power SiP/modules and wafer level packaging.
• Knowledge of wire-bonding and multi-chip module tech is a plus.
• Excellent interpersonal and communication skills.
• Strong analytical and presentation abilities.

Responsibilities

• Manage OSAT/CM suppliers for new package development and qualification.
• Define technology roadmaps and R&D budgets; support customer adoption.
• Design and develop power packaging solutions including SiP, WBG, DBC, and AMB substrates.
• Run DOE to optimize processes and set specifications.
• Qualify new packages with Reliability and Product teams within timelines.
• Establish production controls and ramp-up monitoring.
• Resolve process issues early in production to ensure high quality.
• Maintain design rules for package design.
• Engage with internal/external customers to address complaints and drive growth.

Skills

Power packaging

Wafer-level packaging

Flip-chip packaging

Interconnect tech

DOE/Process optimization

Communication skills

Analytical skills

Team collaboration

Education

Engineering degree

Job description

Renesas Electronics Corp. is seeking a senior Packaging Technology Development lead to drive new package development, qualification and technology roadmaps for AI/datacenter power packaging.

You will coordinate with OSAT/CM partners, Product, Reliability and Operations to ensure timely qualification and smooth production ramp. The role focuses on power SiP/modules, wafer-level and flip-chip packaging, DBC/AMB substrates and related interconnects.