Director, Power Package Design & SiP Innovation

Renesas Electronics Corp.; California (MO); On-site; USD 230,000 - 260,000; Full time

Job summary

Renesas Electronics Corp. is seeking a senior specialist in package technology development to lead NPI/R&D and OSAT management for new power packaging solutions. Focus areas include AI/datacenter power packaging, SiP/module design, and advanced interconnects.

You will work with product and reliability teams to qualify new packages and establish process specs. The role requires 15–20 years in package development, strong knowledge of wafer-level/flip-chip packaging, and excellent analytical

Qualifications

• PhD/MS/BS in physics, chemistry, mechanical, electrical, or materials engineering.
• 15–20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging.
• Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software.
• Knowledge of wire-bonding & multi-chip module technologies is a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Responsibilities

• Develop and drive package technology development, NPI, R&D, and OSAT management for new package development and qualification.
• Design and develop package and interconnect methods for AI/Data center power packaging, including Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages.
• Coordinate with OSAT/CM to benchmark, qualify materials, processes, and subcontractors.
• Lead DOE studies with OSAT/CM to optimize processes and establish process specs.
• Collaborate with Product and Reliability teams to qualify new packages and processes within timelines.
• Resolve process integration issues by ensuring window checks on critical steps.
• Establish production controls and ramp-up monitors to prevent quality incidents.
• Monitor early production issues with OSAT/CM to ensure high-quality parts.
• Build expertise in power SiP/modules, wafer-level packaging, and flip-chip interconnects; contribute to packaging roadmap.
• Participate in packaging roadmap development and execution.
• Address internal/external complaints with cross-functional teams to support business growth.
• Establish and maintain package design rules.

Skills

Power SiP/modules

Wafer-level packaging

Flip-chip packaging

SPC & statistics

Communication skills

Analytical skills

Presentation skills

Education

Doctorate/Master's/Bachelor’s in Physics, Chemistry, Mechanical, Electrical or Materials Eng

Tools

DOE

Job description

Renesas Electronics Corp. is seeking a senior specialist in package technology development to lead NPI/R&D and OSAT management for new power packaging solutions. Focus areas include AI/datacenter power packaging, SiP/module design, and advanced interconnects.

You will work with product and reliability teams to qualify new packages and establish process specs. The role requires 15–20 years in package development, strong knowledge of wafer-level/flip-chip packaging, and excellent analytical