Senior Photonics Packaging Engineer: SiPh & HI Leader

GlobalFoundries inc.; Essex (VT); On-site; USD 132,000 - 242,000; Full time

Job summary

GlobalFoundries is seeking a Photonic Packaging Engineer to lead optical packaging architectures for silicon photonics and co-packaged optics. You will drive fiber-to-chip coupling, HI integration, and thermal/mechanical optimization with cross-functional teams.

The role demands a Master’s degree or higher and 15+ years in semiconductor packaging, with strong English communication and a track record from development to production.

Qualifications

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.
• 15+ years of experience in semiconductor packaging with a focus on photonic or advanced packaging.
• Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
• Experience bringing packaged products from development into production.

Responsibilities

• Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules.
• Develop scalable fiber-to-chip coupling strategies for high-density optical I/O.
• Lead HI packaging using 2.5D/3D/3.5D technologies and collaborate with OSATs.
• Perform multiphysics simulations to optimize package performance and reliability.
• Lead root cause analysis for yield and reliability using FMEA, DOE, and FA tools.
• Ensure mass production readiness and process transfer with internal teams.

Skills

Analytical thinking

Problem solving

Communication skills

English proficiency

Education

Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field

Tools

Lumerical

COMSOL

Python

Job description

GlobalFoundries is seeking a Photonic Packaging Engineer to lead optical packaging architectures for silicon photonics and co-packaged optics. You will drive fiber-to-chip coupling, HI integration, and thermal/mechanical optimization with cross-functional teams.

The role demands a Master’s degree or higher and 15+ years in semiconductor packaging, with strong English communication and a track record from development to production.