Senior Photonics Packaging Engineer – SiPh & HI

GlobalFoundries inc.; Essex (VT); Hybrid; USD 107,000 - 205,000; Full time

Job summary

GlobalFoundries inc. in Essex Junction, VT, seeks a Photonic Packaging Engineer to lead optical packaging development for SiPh-based modules and co-packaged optics.

You will work across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss packaging architectures. The candidate will manage fiber attach, die placement, thermal integration, and reliability simulations, with strong collaboration to ensure mass production readiness and cost efficiency.

Qualifications

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.
• 5+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.
• Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
• Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.
• Understanding of reliability standards and qualification methodologies for optical modules.
• Excellent analytical, problem-solving, and communication skills.
• Experience in bringing packaged products from development into production.
• Strong written and spoken English communication skills.

Responsibilities

• Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
• Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.
• Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
• Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
• Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
• Support cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy.
• Present technical updates and roadmaps to internal stakeholders and external partners.

Skills

Fiber attach processes

Photonic alignment

Optical coupling techniques

English communication

Education

Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field

Tools

Lumerical

COMSOL

Job description

GlobalFoundries inc. in Essex Junction, VT, seeks a Photonic Packaging Engineer to lead optical packaging development for SiPh-based modules and co-packaged optics.

You will work across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss packaging architectures. The candidate will manage fiber attach, die placement, thermal integration, and reliability simulations, with strong collaboration to ensure mass production readiness and cost efficiency.