New Grad Packaging Integration Engineer – Silicon Photonics

GlobalFoundries; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries seeks a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional engineering teams to support development and manufacturing of electro-optical transceivers using GF’s Photonix platform and advanced packaging technologies.

You will contribute to package integration, process development, reliability characterization, and data analysis while gaining hands-on

Qualifications

• GPA of 3.0 or higher in accredited program.
• Basic understanding of semiconductor packaging, silicon photonics, materials science, reliability, manufacturing processes, or related technologies.
• Experience analyzing experimental or engineering data.
• Ability to work effectively within cross-functional teams.
• Strong written and verbal English communication.

Responsibilities

• Support assembly process integration activities for silicon photonics and advanced packaging products.
• Assist with process development, characterization, and qualification activities for new package technologies.
• Analyze engineering and manufacturing data to identify process improvement opportunities.
• Participate in failure analysis and root cause investigations for packaging and assembly-related issues.
• Support package reliability testing and characterization activities.
• Collaborate with design, product, manufacturing, quality, and supplier teams to address technical challenges.
• Document experimental results and communicate findings through presentations and technical reports.
• Participate in continuous improvement initiatives focused on yield, quality, cost, and reliability.

Skills

English fluency

Analytical skills

Problem solving

Team collaboration

Education

Bachelors/Masters/PhD in STEM (Materials/Mechanical/Electrical/Chemical/Physics)

Job description

GlobalFoundries seeks a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional engineering teams to support development and manufacturing of electro-optical transceivers using GF’s Photonix platform and advanced packaging technologies.

You will contribute to package integration, process development, reliability characterization, and data analysis while gaining hands-on