New Grad Packaging Integration Engineer – Silicon Photonics

GlobalFoundries

Essex Junction (VT)

On-site

USD 85,000 - 146,000

Full time

14 days+

Application generator

Turn this role into an interview — a resume and cover letter built around what this employer wants.

Get past ATS filters

Job summary

GlobalFoundries seeks a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional engineering teams to support development and manufacturing of electro-optical transceivers using GF’s Photonix platform and advanced packaging technologies.

You will contribute to package integration, process development, reliability characterization, and data analysis while gaining hands-on

Qualifications

GPA of 3.0 or higher in accredited program.
Basic understanding of semiconductor packaging, silicon photonics, materials science, reliability, manufacturing processes, or related technologies.
Experience analyzing experimental or engineering data.
Ability to work effectively within cross-functional teams.
Strong written and verbal English communication.

Responsibilities

Support assembly process integration activities for silicon photonics and advanced packaging products.
Assist with process development, characterization, and qualification activities for new package technologies.
Analyze engineering and manufacturing data to identify process improvement opportunities.
Participate in failure analysis and root cause investigations for packaging and assembly-related issues.
Support package reliability testing and characterization activities.
Collaborate with design, product, manufacturing, quality, and supplier teams to address technical challenges.
Document experimental results and communicate findings through presentations and technical reports.
Participate in continuous improvement initiatives focused on yield, quality, cost, and reliability.