Lead Optical Packaging Engineer – SiPh & HI Solutions

GlobalFoundries; Essex Junction (VT); On-site; USD 107,000 - 205,000; Full time

Job summary

GlobalFoundries is seeking a Photonic Packaging Engineer to lead development and sustainment of advanced optical packaging for SiPh and co-packaged optics. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss packaging architectures meeting stringent reliability targets.

You will drive HI integration, support mass production readiness, and participate in cost-reduction initiatives while presenting roadmaps to internal and external

Qualifications

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.
• 5+ years in semiconductor packaging, with photonic/advanced packaging focus.
• Hands-on fiber attach, photonic alignment, and optical coupling experience.
• Knowledge of die attach, flip-chip, underfill, molding, and micro-optics integration.
• Understanding of reliability standards for optical modules.
• Strong analytical, problem-solving, and English communication skills.
• Experience bringing packaged products from development into production.

Responsibilities

• Define, design, and qualify optical packaging architectures for SiPh modules, including fiber attach and thermal integration.
• Develop scalable fiber-to-chip coupling strategies for high-density optical I/O.
• Lead HI of photonic and electronic components using 2.5D/3D/3.5D packaging tech.
• Perform multiphysics simulations to optimize package performance.
• Lead root cause analysis for yield and reliability using FMEA, DOE, FA tools.
• Collaborate with OSATs and internal teams for mass production readiness.
• Support cost modeling and drive package cost reduction.
• Present updates and roadmaps to stakeholders and partners.

Skills

Photonic packaging

Fiber attach

Optical alignment

HI packaging

Die attach

Reliability standards

English communication

Education

Master's degree or higher

Tools

Lumerical

COMSOL

Job description

GlobalFoundries is seeking a Photonic Packaging Engineer to lead development and sustainment of advanced optical packaging for SiPh and co-packaged optics. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss packaging architectures meeting stringent reliability targets.

You will drive HI integration, support mass production readiness, and participate in cost-reduction initiatives while presenting roadmaps to internal and external