Senior Photonic Packaging Design & Integration Engineer

GLOBALFOUNDRIES U.S. INC.; Essex Junction (VT); On-site; USD 132,000 - 242,000; Full time

Job summary

GlobalFoundries Vermont seeks a Photonic Packaging Design Integration Engineer to lead the development and sustainment of advanced optical packaging for silicon photonics and co-packaged optics.

You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver low-loss, cost-effective packaging architectures and rigorous reliability targets, with a strong focus on thermal, mechanical, electrical, and optical chip package co-design.

Qualifications

• Must hold MS or PhD in a related field with extensive experience.
• Proven ability to bring packaged products from development into production.
• Experience with HFSS, Zmax, Flotherm or similar tools.
• Strong written and spoken English communication skills.

Responsibilities

• Drives SiPh advanced packaging product innovations and design enablement.
• Support new customer products with innovative design solutions and technology design rules.
• Drives design reviews with cross functional teams.
• Drives cross function teams to resolve technical & yield concerns.
• Develops engineers skills in packaging design constraints and considerations.
• Develops complex analysis models to predict for manufacturability, cost, and quality.
• Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.
• Drives discipline and qualification robustness through a consistent global design processes.
• Drive CIP (Continuous improvement plans) to deliver organizational goals.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Skills

Packaging design

HFSS

Zmax

Flotherm

English

Production transfer

Education

MS or PhD in a relevant field

Tools

HFSS

Zmax

Flotherm

Job description

GlobalFoundries Vermont seeks a Photonic Packaging Design Integration Engineer to lead the development and sustainment of advanced optical packaging for silicon photonics and co-packaged optics.

You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver low-loss, cost-effective packaging architectures and rigorous reliability targets, with a strong focus on thermal, mechanical, electrical, and optical chip package co-design.