Senior Photonics Packaging Design Engineer (SiPh/Co-Pack)

Global Foundries; Essex Junction (VT); On-site; USD 132,000 - 242,000; Full time

Job summary

GlobalFoundries is seeking a Photonic Packaging Design Integration Engineer for its APPC in Vermont. You will lead development and sustainment of optical packaging solutions for SiPh and co-packaged optics, collaborating across photonics, electrical, mechanical and manufacturing teams to deliver low-loss, reliable packaging architectures.

The role emphasizes thermal, mechanical, electrical and optical co-design, with a focus on product and module performance, packaging rules, material selection,

Qualifications

• MS or PhD with 15+ years (or 20+ years for MS path) of experience in packaging

Responsibilities

• Lead SiPh advanced packaging product innovations and design enablement.
• Support customer products with innovative design solutions and rules.
• Lead design reviews with cross-functional teams.
• Drive cross-functional teams to resolve technical & yield concerns.
• Develop models to predict manufacturability, cost and quality.
• Ensure requirements are met and performance aligns with customer expectations.
• Drive global design process discipline and CIP initiatives.

Skills

Advanced packaging design

HFSS/Zmax/Flotherm

Packaging design expertise

English communication

Production handoff experience

Education

MS or PhD in relevant field

Tools

HFSS

Zmax

Flotherm

Job description

GlobalFoundries is seeking a Photonic Packaging Design Integration Engineer for its APPC in Vermont. You will lead development and sustainment of optical packaging solutions for SiPh and co-packaged optics, collaborating across photonics, electrical, mechanical and manufacturing teams to deliver low-loss, reliable packaging architectures.

The role emphasizes thermal, mechanical, electrical and optical co-design, with a focus on product and module performance, packaging rules, material selection,