Director, Advanced Packaging & Silicon Photonics

GlobalFoundries inc.; Essex Junction (VT); On-site; USD 167,000 - 290,000; Full time

Job summary

GlobalFoundries in Essex Junction, VT seeks a Director of Advanced Packaging Development to lead the development and industrialization of advanced packaging solutions for next-generation silicon photonics and optical interconnect products. This role partners with Product Line Management, Business Development, and engineering to shape roadmaps and enable commercialization of future platforms.

The successful candidate will build and lead a high-performing team, manage external ecosystem partners,

Qualifications

• 15+ years of experience in semiconductor packaging, advanced packaging, photonics packaging, or related technologies.
• Demonstrated experience leading complex technology development organizations and multidisciplinary engineering teams.
• Strong knowledge of advanced packaging technologies including flip-chip assembly, wafer-level packaging, optical packaging, high-density interconnects, thermal management, and reliability qualification.
• Experience working directly with OSATs, outsourced manufacturing partners, and semiconductor supply chains.
• Proven ability to lead strategic customer engagements and external partnerships.
• Excellent communication, leadership, and executive presentation skills.

Responsibilities

• Lead advanced packaging development organization responsible for package architecture, assembly processes, qualification strategy, manufacturing readiness, and product industrialization.
• Build and develop a high-performing team focused on technical excellence, innovation, and execution.
• Drive technology decisions related to package design, materials, thermal management, reliability, manufacturability, and cost optimization.
• Establish development methodologies, design guidelines, and qualification strategies to support product scale-up and commercialization.
• Define and maintain the advanced packaging technology roadmap supporting silicon photonics, optical interconnect, co-packaged optics, AI networking, and future platform developments.
• Align packaging investments and development priorities with product roadmaps, customer requirements, and business objectives.

Skills

Leadership

Executive communication

Customer engagement

External partnerships

Strategic thinking

Education

BS/MS/PhD in Electrical/Mechanical/Materials/Physics

Job description

GlobalFoundries in Essex Junction, VT seeks a Director of Advanced Packaging Development to lead the development and industrialization of advanced packaging solutions for next-generation silicon photonics and optical interconnect products. This role partners with Product Line Management, Business Development, and engineering to shape roadmaps and enable commercialization of future platforms.

The successful candidate will build and lead a high-performing team, manage external ecosystem partners,