Photonics Packaging Integration Engineer (2.5D/3D)

GLOBALFOUNDRIES U.S. INC.; Essex Junction (VT); On-site; USD 94,000 - 175,000; Full time

Job summary

GlobalFoundries U.S. INC.

seeks a hands-on assembly integration professional to deliver electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D/3D modalities. The role focuses on tool-process interactions for SiPh Flip Chip assembly, emphasizing product and module reliability, packaging design rules, materials selection, and reliability qualifications for chiplet/module packages.

Qualifications

• Strong written and spoken English communication skills.
• Experience in failure analysis, DOE, and packaging process integration.
• Experience bringing packaged products from development into production.

Responsibilities

• Defines process integration specifications for assembly flow of co-packaged optics modules driving toward cost, yield, and reliability targets.
• Establishment of manufacturing driven design rules.
• Ensures that all packaged products meet a standardized set of quality expectations through design reviews, materials selection and FMEAs.
• Drives SiPh advanced packaging product innovations and design enablement for customers, and efficient manufacturing with OSAT ecosystems.
• Provides tools and complex analysis of quality issues and associated financial implications.
• Drives discipline and qualification robustness through a consistent global qualification process.
• Develops and improves test structures for fast, rigorous characterization of process.
• Performs project management and data analysis; resolves process integration issues; supports new designs.

Skills

English communication

Education

MS or PhD + 4+ years experience

Job description

GlobalFoundries U.S. INC.

seeks a hands-on assembly integration professional to deliver electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D/3D modalities. The role focuses on tool-process interactions for SiPh Flip Chip assembly, emphasizing product and module reliability, packaging design rules, materials selection, and reliability qualifications for chiplet/module packages.