PMTS Photonics Packaging Design Integration

GLOBALFOUNDRIES U.S. INC.; Essex Junction (VT); On-site; USD 132,000 - 242,000; Full time

Job summary

GlobalFoundries Vermont seeks a Photonic Packaging Design Integration Engineer to lead the development and sustainment of advanced optical packaging for silicon photonics and co-packaged optics.

You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver low-loss, cost-effective packaging architectures and rigorous reliability targets, with a strong focus on thermal, mechanical, electrical, and optical chip package co-design.

Qualifications

• Must hold MS or PhD in a related field with extensive experience.
• Proven ability to bring packaged products from development into production.
• Experience with HFSS, Zmax, Flotherm or similar tools.
• Strong written and spoken English communication skills.

Responsibilities

• Drives SiPh advanced packaging product innovations and design enablement.
• Support new customer products with innovative design solutions and technology design rules.
• Drives design reviews with cross functional teams.
• Drives cross function teams to resolve technical & yield concerns.
• Develops engineers skills in packaging design constraints and considerations.
• Develops complex analysis models to predict for manufacturability, cost, and quality.
• Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.
• Drives discipline and qualification robustness through a consistent global design processes.
• Drive CIP (Continuous improvement plans) to deliver organizational goals.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Skills

Packaging design

HFSS

Zmax

Flotherm

English

Production transfer

Education

MS or PhD in a relevant field

Tools

HFSS

Zmax

Flotherm

Job description

About GlobalFoundries: GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role

As a Photonic Packaging Design Integration Engineer within GF’s APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets. The candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design. Focus on product and module performance, reliability packaging design rules, materials selection criteria, definition of electrical, photonic and thermal definition for chiplet and product modules as well as reliability qualification approaches.

Essential Responsibilities

• Drives SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
• Support new customer products with innovative design solutions and technology design rules.
• Drives design reviews with cross functional teams.
• Drives cross function teams to resolve technical & yield concerns.
• Develops engineers skills in packaging design constraints and considerations.
• Develops complex analysis models to predict for manufacturability, cost, and quality.
• Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.
• Drives discipline and qualification robustness through a consistent global design processes.
• Drive CIP (Continuous improvement plans) to deliver organizational goals.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Other Responsibilities

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications

• MS +20, or PhD + 15 or more years of experience.
• Experience in bringing packaged products from development into production.
• Experience with HFSS, Zmax, Flotherm, or other design and modeling tools.
• Advanced packaging design and layout expertise.
• Strong written and spoken English communication skills.

Preferred Qualifications

• Materials science, thermal, mechanical, simulation background.
• Experience with failure analysis, design of experiments, & packaging process integration.
• Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.
• Expert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
• Experiment Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.

Expected Salary Range $131,900.00 - $241,500.00 The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [e-mail] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory. All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

We shape what's essential At GlobalFoundries you will find a vibrant work environment where collaboration and innovation thrive. Our diverse and global team shares a culture of respect and inclusivity, representing the best in the industry. We celebrate success together and are united by our dedication to excellence and our desire to improve and empower the world.