Senior Packaging Module Engineer – Substrate & Innovation

Intel Corp.; Phoenix (AZ); Híbrido; USD 134.000 - 255.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Stock bonuses

Health benefits

Vacation

Descripción de la vacante

Intel Corporation in Chandler, AZ is seeking a Senior Packaging Module Development Engineer to advance IC substrate and packaging technologies. You will develop, optimize, and apply DOE-driven experiments, data analytics, and modeling to improve processes, materials, and equipment configurations across global teams.

The role requires strong technical leadership, cross-functional collaboration, and clear communication to enable knowledge transfer and project milestones in a hybrid work

Formación

• Bachelor's or higher in a relevant engineering/materials field with multi-year experience in packaging or materials processing.
• DOE, data analysis, and process control tools are required.
• Experience with IC substrate and advanced packaging processing principles is preferred.
• Engineering programming tools for modeling and analysis are desired.

Responsabilidades

• Develop and optimize packaging processes and materials to meet quality and yield targets.
• Define equipment configurations and process parameters for advanced packaging.
• Design and execute DOE studies to characterize process windows.
• Apply data analytics and modeling to improve manufacturing, materials, and tooling.
• Collaborate with cross-functional teams and document technical work.

Conocimientos

DOE

Statistical data analysis

Process control

IC substrate knowledge

Engineering data analysis

Educación

Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or related field

Master's degree in the above fields

PhD in the above fields

Herramientas

JMP

Python

MATLAB

COMSOL

Ansys

Descripción del empleo

Intel Corporation in Chandler, AZ is seeking a Senior Packaging Module Development Engineer to advance IC substrate and packaging technologies. You will develop, optimize, and apply DOE-driven experiments, data analytics, and modeling to improve processes, materials, and equipment configurations across global teams.

The role requires strong technical leadership, cross-functional collaboration, and clear communication to enable knowledge transfer and project milestones in a hybrid work