Hybrid Packaging R&D Engineer (Substrate Tech)

Intel Corporation; Phoenix (AZ); Hybrid; USD 134,000 - 189,000; Full time

Job summary

Intel Corporation in Phoenix, AZ is seeking a Packaging Module Development Engineer to advance substrate packaging technologies. You will develop and optimize packaging processes, materials, and equipment for reliable, cost-effective manufacturing in a high-volume context.

The role requires a PhD in materials or a related engineering field with 1+ years of relevant experience, plus strong DOE, data analysis, and material characterization skills. Hybrid on-site/off-site work is offered.

Qualifications

• PhD degree in Materials Science or related engineering field and 1+ years of related experience.
• Experience in combining engineering judgment with data analysis to draw conclusions and design experiments.
• Knowledge of material characterization techniques and DOE, SPC.

Responsibilities

• Develop and optimize advanced packaging processes, materials, and equipment to meet reliability, quality, and cost targets.
• Design and implement process specifications, workflows, and equipment configurations for new technologies.
• Conduct DOE to characterize process windows and interactions between equipment, materials, and chemistry.
• Drive continuous improvement to enhance process capability, stability, and productivity.
• Collaborate with cross-functional teams to resolve technical challenges and deliver solutions.
• Establish material specifications and partner with suppliers to ensure adherence to standards.
• Document advancements and process innovations through technical reports and white papers.
• Provide sustaining support for equipment performance and process health in high-volume manufacturing.

Skills

Data analysis

DOE

Statistical methods

Material characterization

Problem solving

Education

PhD in Materials Science or related engineering field

Tools

DOE tools

Job description

Intel Corporation in Phoenix, AZ is seeking a Packaging Module Development Engineer to advance substrate packaging technologies. You will develop and optimize packaging processes, materials, and equipment for reliable, cost-effective manufacturing in a high-volume context.

The role requires a PhD in materials or a related engineering field with 1+ years of relevant experience, plus strong DOE, data analysis, and material characterization skills. Hybrid on-site/off-site work is offered.