Packaging Equipment Engineer for Next-Gen Semiconductors

Intel Corporation

Phoenix (AZ)

On-site

USD 99,000 - 189,000

Full time

6 days ago

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Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Job summary

Intel Corporation in Phoenix, AZ seeks a Packaging Module Development Engineer to advance assembly and packaging technologies. You will develop processes and equipment to improve efficiency, reliability, and quality across next‑generation packaging solutions.

Responsibilities include applying DOE and SPC, designing reusable test equipment, and ensuring manufacturability of layouts while driving continuous improvement in workflows and supplier collaboration. On‑site role in Phoenix.

Qualifications

Bachelor’s degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field.
3+ years of relevant experience (or 2+ years with a Master’s/PhD).
Experience with SPC and DOE principles.

Responsibilities

Develop and optimize assembly processes and equipment to meet quality, yield, and cost goals.
Apply DOE and SPC to refine processes and document findings in technical reports.
Design and maintain equipment to test packaging technologies under temperature, humidity, and stress.
Ensure manufacturability of layouts and oversee manufacturing workflows lifecycles.
Collaborate with supplier quality and procurement to meet performance benchmarks.