Senior Packaging Module Engineer — Hybrid (Substrates)

Intel Corporation; Chandler (AZ); Hybride; USD 134 000 - 255 000; Plein temps

Avantages offerts par ce poste

Stock bonuses

Health benefits

Retirement plan

Vacation

Résumé du poste

Intel Corporation in Chandler, Arizona seeks a Senior Packaging Module Development Engineer to advance IC substrate and packaging technologies. You will develop and optimize processes, materials, and equipment configurations, leveraging DOE and data analytics to drive improvements.

The role requires leadership across cross-functional teams, strong problem-solving, and effective technical communication. Hybrid work arrangements and a competitive compensation package are offered.

Qualifications

• Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or a related field with 6+ years of related experience; OR
• Master’s degree in the above fields with 4+ years of related experience; OR
• PhD in the above fields with 2+ years of related experience.

Responsabilités

• Process & Material Optimization: Develop and refine packaging processes and materials to meet quality, reliability, yield, and cost targets.
• Workflow & Equipment Definition: Define and establish equipment configurations, process parameters, and integrated workflows for IC substrate and packaging technologies.
• Experimental Characterization (DOE): Design and execute experimental plans using DOE principles to characterize process windows and analyze interactions.
• Data Analytics & Process Modeling: Apply statistical methods and data analytics to optimize processes and resolve development challenges.
• Continuous Improvement: Implement improvements to enhance tool stability, product quality, and manufacturing productivity.
• Cross-Functional Problem Solving: Partner with engineering, materials, and equipment teams for root-cause troubleshooting.
• Technical Documentation & Transfer: Author documentation to enable knowledge transfer across global teams.

Connaissances

Technical leadership

Analytical problem solving

Clear technical communication

Adaptability & ownership

Formation

Bachelor's degree in Materials Science/Mechanical/Chemical/Polymer Engineering

Master's degree in related fields

PhD in related fields

Outils

JMP

Python

MATLAB

Description du poste

Intel Corporation in Chandler, Arizona seeks a Senior Packaging Module Development Engineer to advance IC substrate and packaging technologies. You will develop and optimize processes, materials, and equipment configurations, leveraging DOE and data analytics to drive improvements.

The role requires leadership across cross-functional teams, strong problem-solving, and effective technical communication. Hybrid work arrangements and a competitive compensation package are offered.