• Senior Packaging Module Development Engineer

100 Intel Corporation; Chandler (AZ); Hybrid; USD 134,000 - 255,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Chandler, Arizona is seeking a Senior Packaging Module Development Engineer to advance IC substrate and packaging technologies. You will develop, optimize, and implement processes, materials, and equipment configurations for next-generation packaging, combining experiments with data analytics.

You'll design DOE studies, perform statistical analysis, and model processes to improve yield, quality, and productivity, partnering with cross-functional teams and documenting

Qualifications

• Minimum 6+ years in materials/packaging or related field with advanced degree options.
• Experience with DOE, data analysis, and process control tools.
• Familiarity with IC substrate/packaging processing principles and engineering software.

Responsibilities

• Develop and refine packaging processes and materials to meet quality, reliability, yield, and cost targets.
• Define equipment configurations, parameters and workflows for advanced packaging tech.
• Design and execute DOE plans to characterize process windows and interactions.
• Apply statistical methods and data analytics to optimize manufacturing and resolve challenges.
• Implement continuous improvements to enhance tool stability, product quality, and productivity.
• Collaborate with cross-functional teams to drive process development and troubleshoot root causes.
• Prepare technical documentation and transfer knowledge across global teams.

Skills

Technical leadership

Analytical mindset

Technical communication

DOE methods

Education

Materials Science / related engineering

Tools

JMP

Python

MATLAB

COMSOL

Ansys

Job description

Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. Join Intel's Substrate Packaging Technology Development (SPTD) organization, a global leader in developing advanced substrate and packaging solutions. Our team is dedicated to enabling Intel's roadmap of innovative packaging technologies, focusing on materials development, process optimization and simulation, and process equipment advancements. SPTD supports Intel's mission of delivering high-performance, cost-effective products that power the future of computing.

We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a key part in advancing Intel's IC substrate and packaging technologies. You will develop, optimize, and implement innovative processes, materials, and equipment configurations to enable next‑generation packaging solutions. Combining physical experimentation with statistical data analytics and process modeling, your work will directly impact manufacturing efficiency, product quality, and reliability across Intel's advanced packaging portfolio.

Key Responsibilities

• Process & Material Optimization: Develop and refine packaging processes and materials to meet stringent quality, reliability, yield, and cost targets.
• Workflow & Equipment Definition: Define and establish equipment configurations, process parameters, and integrated workflows for advanced IC substrate and packaging technologies.
• Experimental Characterization (DOE): Design and execute experimental plans using Design of Experiments (DOE) principles to characterize process windows and analyze complex material and equipment interactions.
• Data Analytics & Process Modeling: Apply statistical methods, deep data analytics, and engineering scripting tools to optimize manufacturing processes, drive material enhancements, and resolve IC substrate development challenges.
• Continuous Improvement: Implement continuous process improvements to enhance tool stability, product quality, and manufacturing productivity.
• Cross-Functional Problem Solving: Partner with cross-functional engineering, materials, and equipment teams to drive process development and root-cause troubleshooting initiatives.
• Technical Documentation & Transfer: Author technical documentation, including white papers and process specifications, to enable seamless technology transfer and knowledge sharing across global teams.

As a Successful Candidate, You Will Bring

• Technical Leadership & Influence: Strong leadership skills to guide cross-functional engineering efforts and drive technical alignment across diverse teams.
• Analytical Problem Solving: Deep analytical mindset with a passion for combining empirical data and theoretical modeling to solve complex materials and processing challenges.
• Clear Technical Communication: Concise written and verbal communication style to author specifications, publish internal white papers, and present findings to stakeholders.
• Adaptability & Ownership: Self-directed engineer who thrives in a dynamic R&D environment and takes full accountability for project milestones.

Qualifications

Minimum Qualifications:

• Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or a related field, with 6+ years of related experience; OR Master's degree in the above fields, with 4+ years of related experience; OR PhD in the above fields, with 2+ years of related experience.
• Relevant experience can be any of the following: Design of Experiments (DOE), statistical data analysis, and process control tools; Understanding of IC substrate and/or advanced packaging processing principles; Engineering programming tools like JMP, Python, MATLAB, or similar software for process modeling and/or data analysis;

Preferred Qualifications 3+ years of experience in:

• Dielectric materials formulation (structure/property relations expertise) and/or processing.
• Finite Element Analysis (FEA) modeling tools such as COMSOL, Ansys, etc.
• Machine learning or artificial intelligence applications for engineering scenarios.
• Designing experimental setups to validate modeling and simulation outputs.

Job Type

Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off‑site. Job posting details (such as work model, location or time type) are subject to change. Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.