Senior IC Packaging & Substrate Development Engineer

Intel Corporation

Phoenix (AZ)

Híbrido

USD 134.000 - 255.000

Jornada completa

Hace 2 días

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Descripción de la vacante

Intel Corporation is seeking a Senior Packaging Module Development Engineer in Chandler, Arizona, to advance IC substrate and packaging technologies. You will develop, optimize, and implement processes, materials, and equipment configurations, blending physical experiments with data analytics to improve manufacturing efficiency and product quality.

The role emphasizes technical leadership, problem solving, and clear communication across global teams, with a hybrid work model and competitive

Formación

Experience with DOE, statistical data analysis, and process control tools.
Understanding of IC substrate and advanced packaging processing principles.
Engineering programming tools for process modeling and data analysis (JMP/Python/MATLAB).
Strong cross-functional collaboration and technical leadership abilities.

Responsabilidades

Process & Material Optimization to meet quality, reliability, yield, and cost targets.
Define equipment configurations and process parameters for IC substrate packaging.
Design and execute DOE-based experiments to map process windows.
Apply statistical methods and data analytics to optimize manufacturing processes.
Implement continuous improvement to enhance tool stability and productivity.
Collaborate with cross-functional teams for root-cause troubleshooting and tech transfer.