Senior Packaging Module Dev Engineer - Hybrid
100 Intel Corporation
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Résumé du poste
Intel Corporation in Chandler, Arizona is seeking a Senior Packaging Module Development Engineer to advance IC substrate and packaging technologies. You will develop, optimize, and implement processes, materials, and equipment configurations for next-generation packaging, combining experiments with data analytics.
You'll design DOE studies, perform statistical analysis, and model processes to improve yield, quality, and productivity, partnering with cross-functional teams and documenting
Qualifications
- Minimum 6+ years in materials/packaging or related field with advanced degree options.
- Experience with DOE, data analysis, and process control tools.
- Familiarity with IC substrate/packaging processing principles and engineering software.
Responsabilités
- Develop and refine packaging processes and materials to meet quality, reliability, yield, and cost targets.
- Define equipment configurations, parameters and workflows for advanced packaging tech.
- Design and execute DOE plans to characterize process windows and interactions.
- Apply statistical methods and data analytics to optimize manufacturing and resolve challenges.
- Implement continuous improvements to enhance tool stability, product quality, and productivity.
- Collaborate with cross-functional teams to drive process development and troubleshoot root causes.
- Prepare technical documentation and transfer knowledge across global teams.
Connaissances
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Outils
Description du poste
Intel Corporation in Chandler, Arizona is seeking a Senior Packaging Module Development Engineer to advance IC substrate and packaging technologies. You will develop, optimize, and implement processes, materials, and equipment configurations for next-generation packaging, combining experiments with data analytics.
You'll design DOE studies, perform statistical analysis, and model processes to improve yield, quality, and productivity, partnering with cross-functional teams and documenting
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