Hybrid Advanced Packaging Engineer: Innovation & Process Lead

Intel Corporation; Chandler (AZ); Hybrid; USD 134,000 - 189,000; Full time

Job summary

Intel Corporation in Arizona seeks an experienced Packaging Module Development Engineer to design and optimize packaging processes, materials, and equipment for next‑generation semiconductor technologies. You will drive reliability, manufacturability, and performance in high‑volume manufacturing.

The role emphasizes collaboration across teams, statistical design of experiments (DOE), and process qualification, with documentation of findings and supplier coordination.

Qualifications

• Requires a STEM bachelor's degree with 3+ years' industry experience or advanced degrees as alternative paths.
• Experience in process development and/or equipment qualification for manufacturing applications.
• Preferred: experience leading technical teams and applying SPC/DOE and process characterization techniques.

Responsibilities

• Develop, optimize, and qualify packaging assembly processes, materials, and equipment to meet quality, reliability, yield, and cost targets.
• Drive experimental design using SPC and DOE methodologies.
• Innovate techniques, materials, and tools to address packaging reliability and manufacturability challenges.
• Collaborate with cross-functional teams to mitigate risks and ensure product development success.
• Establish process specifications and material requirements with supplier collaboration.
• Document findings and improvements through reports and technical papers.
• Provide support for equipment performance and process health in development and high-volume manufacturing.

Skills

Strong communication

Strong analytical

Education

Bachelor's degree in Engineering/Physics/Chemistry

Master's degree in Engineering/Physics/Chemistry

PhD in Engineering/Physics/Chemistry

Tools

Python

MATLAB

SQL

Job description

Intel Corporation in Arizona seeks an experienced Packaging Module Development Engineer to design and optimize packaging processes, materials, and equipment for next‑generation semiconductor technologies. You will drive reliability, manufacturability, and performance in high‑volume manufacturing.

The role emphasizes collaboration across teams, statistical design of experiments (DOE), and process qualification, with documentation of findings and supplier coordination.