Advanced Packaging Module Engineer: Plating & Process Innovation

Intel Corporation; Hillsboro (OR); On-site; USD 134,000 - 255,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Hillsboro, Oregon, is seeking a Module Development Engineer to advance semiconductor manufacturing capabilities. You will develop and optimize advanced processes, run feasibility studies, and enable high-volume production for next-generation device architectures.

This role emphasizes process innovation, cross-functional collaboration, and delivering scalable solutions to strengthen Intel's industry leadership.

Qualifications

• Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or related STEM field with 4+ years of relevant experience.
• OR PhD in the same fields with 2+ years of relevant experience.
• 2+ years of experience in semiconductor processing or advanced packaging technology development and process development methodologies, statistical process control or manufacturing process improvements.

Responsibilities

• Develop and optimise advanced manufacturing processes, including material selection, equipment metrology, and system design.
• Conduct feasibility studies and simulations to meet device performance and reliability specifications.
• Drive process innovation and pathfinding activities to enable next-generation semiconductor architectures.
• Collaborate with equipment and material suppliers to design and implement innovative process technologies.
• Develop technology roadmaps to guide future manufacturing needs and set industry standards.
• Monitor production efficiency and recommend modifications to improve scalability and output.
• Utilise statistical process control and data analytics to ensure process stability and continuous improvement.
• Partner with cross-functional teams to align on process integration and project deliverables.

Skills

Semiconductor processing

Process development methodologies

Statistical process control

Data analytics

Cross-functional collaboration

Education

Master's degree (STEM)

PhD (STEM)

Tools

Plasma etch

Plating processes

Thin-film deposition

Wafer-level assembly

Hybrid bonded interconnects

Job description

Intel Corporation in Hillsboro, Oregon, is seeking a Module Development Engineer to advance semiconductor manufacturing capabilities. You will develop and optimize advanced processes, run feasibility studies, and enable high-volume production for next-generation device architectures.

This role emphasizes process innovation, cross-functional collaboration, and delivering scalable solutions to strengthen Intel's industry leadership.