Packaging Innovation Engineer – Advanced Packaging

Intel Corporation; Phoenix (AZ); Hybrid; USD 134,000 - 189,000; Full time

Job summary

Intel Corporation in Phoenix, AZ, seeks an Advanced Packaging Development Engineer to design, optimize, and qualify packaging processes and materials for high-volume manufacturing. You will drive reliability, yield, and cost improvements while advancing next-generation semiconductor packaging technologies.

The role requires collaboration across matrixed teams, hands-on process development, and strong data analysis. A hybrid work model is offered with competitive compensation and benefits.

Qualifications

• Bachelor's degree with 3+ years industry experience or Master's with 2+ years.
• PhD with no prior professional experience.
• Experience with process development and equipment qualification for manufacturing applications.

Responsibilities

• Develop, optimize, and qualify packaging assembly processes, materials, and equipment.
• Drive SPC and DOE to improve processes.
• Collaborate with cross-functional teams to mitigate risks and ensure product development success.
• Document technical findings and process improvements and advancements.

Skills

Communication

Analytical skills

Cross-functional collaboration

Education

Bachelor's degree in Engineering/Physics/Chemistry or related STEM

Master's degree in Engineering/Physics/Chemistry or related STEM

PhD in Engineering/Physics/Chemistry or related STEM

Tools

Python

MATLAB

SQL

Job description

Intel Corporation in Phoenix, AZ, seeks an Advanced Packaging Development Engineer to design, optimize, and qualify packaging processes and materials for high-volume manufacturing. You will drive reliability, yield, and cost improvements while advancing next-generation semiconductor packaging technologies.

The role requires collaboration across matrixed teams, hands-on process development, and strong data analysis. A hybrid work model is offered with competitive compensation and benefits.