Night-Shift Packaging Module Engineer (Semiconductors)

Intel Corporation; Phoenix (AZ); On-site; USD 85,000 - 163,000; Full time

Job summary

Intel Corporation in Phoenix, Arizona is seeking a Packaging Module Development Engineer to lead the design and optimization of advanced packaging processes for next-generation semiconductor products. You will apply SPC and DOE methodologies, develop tools, and collaborate with suppliers to ensure high quality and reliability.

The role involves overseeing packaging process lifecycle, establishing material specs, and driving standardization across product qualification and manufacturing quality

Qualifications

• Bachelor’s degree in mechanical/materials/chemical/electrical engineering or related field with 2+ years of hands-on experience in assembly and packaging technologies.
• Not eligible for Intel immigration sponsorship.

Responsibilities

• Design and develop assembly packaging processes and equipment.
• Optimize manufacturing processes for quality, reliability, cost, yield, productivity, and manufacturability.

Skills

Packaging experience

SPC & DOE

Data analysis tools

Education

Bachelor’s degree in engineering or related field

Tools

Python

JMP

Minitab

Job description

Intel Corporation in Phoenix, Arizona is seeking a Packaging Module Development Engineer to lead the design and optimization of advanced packaging processes for next-generation semiconductor products. You will apply SPC and DOE methodologies, develop tools, and collaborate with suppliers to ensure high quality and reliability.

The role involves overseeing packaging process lifecycle, establishing material specs, and driving standardization across product qualification and manufacturing quality