Packaging Equipment Engineer – Innovate & Optimize Assembly

Intel Corporation; Chandler (AZ); On-site; USD 99,000 - 189,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health and retirement benefits

Vacation and parental leave

Job summary

Intel Corporation's Packaging Module Development team is seeking a Packaging Module Development Engineer to advance assembly and packaging technologies. You will develop and optimize processes and equipment to support next-generation packaging solutions, enhancing manufacturing efficiency, product reliability, and quality across Intel's diverse product portfolio.

The role involves applying DOE and SPC, designing equipment to test packaging under thermal and mechanical stress, and ensuring

Qualifications

• Bachelor’s or higher in a STEM field with several years of experience in packaging/mechanical design.
• Experience implementing SPC and DOE principles in manufacturing environments.
• Proficiency with SolidWorks and AutoCAD for mechanical design.

Responsibilities

• Develop and optimize assembly processes and equipment for quality, cost, yield, and manufacturability.
• Apply DOE and SPC methods and document findings in technical reports.
• Design and maintain equipment to evaluate packaging under simulated field conditions.
• Ensure manufacturability of layouts in package design and oversee workflows.
• Define material specs and collaborate with supplier quality and procurement.
• Lead problem-solving and drive continuous improvement in processes.

Skills

SPC

DOE

SolidWorks

AutoCAD

Geometric Dimensioning and Tolerancing

Education

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field

Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field

PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field

Tools

SolidWorks

AutoCAD

Job description

Intel Corporation's Packaging Module Development team is seeking a Packaging Module Development Engineer to advance assembly and packaging technologies. You will develop and optimize processes and equipment to support next-generation packaging solutions, enhancing manufacturing efficiency, product reliability, and quality across Intel's diverse product portfolio.

The role involves applying DOE and SPC, designing equipment to test packaging under thermal and mechanical stress, and ensuring