Senior Packaging and Chiplet Integration Research Lead

Intel Corporation; Phoenix (AZ); Hybrid; USD 221,000 - 312,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Hybrid work model

Retirement plan

Job summary

Intel Corporation, based in Phoenix, leads advanced packaging integration research to enable next‑generation heterogeneous semiconductor technology. The manager guides feasibility studies from concept through prototype learning and readiness assessments, collaborating across device, design, process, materials, reliability, and manufacturing teams.

The role emphasizes defining strategies, managing multi-disciplinary teams, and communicating progress to senior leaders, with a focus on 2.5D/3DIC,

Qualifications

• Demonstrated experience leading advanced technology research programs.
• Ability to convert ambiguous integration challenges into clear hypotheses, experimental plans, milestones, and actionable recommendations.
• Strong understanding of package-system integration, chiplet architectures, interconnects, substrates, and manufacturability trade-offs.

Responsibilities

• Lead packaging integration research programs focused on heterogeneous integration, chiplets, 2.5D/3DIC, and related technologies.
• Define integration strategy, roadmaps, milestones, and criteria aligned to product and system scaling.
• Direct multidisciplinary teams across engineering and product groups to translate system requirements into integration solutions.

Skills

Package co-optimization

Advanced packaging

Chiplet architectures

2.5D/3DIC

Hybrid bonding

Power integrity

Thermal-mechanical modeling

Leadership

Education

Master’s degree in Electrical Engineering

Ph.D. preferred

Tools

Finite element modeling

Simulation

Job description

Intel Corporation, based in Phoenix, leads advanced packaging integration research to enable next‑generation heterogeneous semiconductor technology. The manager guides feasibility studies from concept through prototype learning and readiness assessments, collaborating across device, design, process, materials, reliability, and manufacturing teams.

The role emphasizes defining strategies, managing multi-disciplinary teams, and communicating progress to senior leaders, with a focus on 2.5D/3DIC,