Packaging Research Engineer — 2.5D/3DIC & Chiplets (Hybrid)

Intel Corporation; Chandler (AZ); Hybrid; USD 122,000 - 232,000; Full time

Benefits offered by this job

Total rewards package

Job summary

Intel Corporation in the United States is seeking a Semiconductor Packaging Research Engineer to drive technology research for advanced packaging and heterogeneous integration. The role focuses on evaluating new architectures, materials, interconnects, reliability risks, and manufacturability trade-offs for future products.

The candidate will collaborate across research, design, process, materials, reliability, manufacturing, and university teams; required qualifications include Master’s or

Qualifications

• Master’s or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
• 1+ years’ experience in semiconductor packaging research, advanced packaging integration, or modeling/simulation.
• Experience with advanced packaging technologies such as chiplets, 2.5D/3DIC, or hybrid bonding.

Responsibilities

• Research advanced packaging concepts such as chiplets and 2.5D/3DIC.
• Drive process integration learning or modeling/simulation to assess feasibility and reliability.
• Translate product needs into research plans and document outputs through reports and IP.
• Collaborate across research, design, process, materials, reliability, and manufacturing teams.

Skills

Advanced packaging research

Heterogeneous integration

Thermal modeling

DOE

Prototype learning

Education

Master’s or Ph.D. in Mechanical or Electrical Engineering

Materials Science or related field

Tools

ANSYS

Abaqus

COMSOL

HFSS

Cadence

MATLAB

Python

JMP

Job description

Intel Corporation in the United States is seeking a Semiconductor Packaging Research Engineer to drive technology research for advanced packaging and heterogeneous integration. The role focuses on evaluating new architectures, materials, interconnects, reliability risks, and manufacturability trade-offs for future products.

The candidate will collaborate across research, design, process, materials, reliability, manufacturing, and university teams; required qualifications include Master’s or