Advanced Packaging Research Engineer: Chiplets & 3DIC

Intel; Hillsboro (OR); Hybrid; USD 122,000 - 232,000; Full time

Job summary

Intel is seeking a Semiconductor Packaging Research Engineer to drive research for advanced packaging and heterogeneous integration. The role targets experts in either packaging process integration or modeling/simulation, evaluating architectures, materials, interconnects, reliability risks, and manufacturability trade-offs for future products.

Collaborate across research, design, process, materials, reliability, manufacturing, supplier, university, and ecosystem teams; translate product needs

Qualifications

• Master’s or Ph.D. in a relevant engineering field.
• 1+ years’ experience in semiconductor packaging research or related areas.
• Experience with packaging technologies and/or modeling/simulation.
• Strong problem-solving and cross-functional collaboration skills.

Responsibilities

• Research advanced packaging concepts (chiplets, 2.5D/3DIC, interposers).
• Drive process integration learning or modeling to assess feasibility and reliability.
• Define integration flows, DOE plans, and risk mitigation paths.
• Develop and validate models using data from experiments and failure analysis.
• Document outputs via reports, IP, publications, and transfer inputs.

Skills

Advanced packaging

Chiplets

Heterogeneous integration

DOE

Multi-physics modeling

Education

Master's or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, Applied Physics, Computational Mechanics, Microelectronics, or related field

Tools

ANSYS

Abaqus

COMSOL

HFSS

Cadence

MATLAB

Python

JMP

Job description

Intel is seeking a Semiconductor Packaging Research Engineer to drive research for advanced packaging and heterogeneous integration. The role targets experts in either packaging process integration or modeling/simulation, evaluating architectures, materials, interconnects, reliability risks, and manufacturability trade-offs for future products.

Collaborate across research, design, process, materials, reliability, manufacturing, supplier, university, and ecosystem teams; translate product needs