Senior Packaging Equipment Development Lead

Intel Corporation; Phoenix (AZ); On-site; USD 181,000 - 255,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health insurance

Retirement savings plan

Vacation

Job summary

Intel Corporation is seeking a Packaging Equipment Development Manager to lead innovation in semiconductor packaging, oversee new equipment introductions, and drive seamless integration with manufacturing. The role sits within Assembly Technology Development, contributing to Intel's advanced packaging roadmap and high-volume production capabilities.

The position emphasizes leadership, strategic decision-making, and collaboration with internal and external partners to deliver cutting-edge

Qualifications

• Bachelor's degree with 9+ years of relevant experience.
• Master's degree with 6+ years of relevant experience.
• PhD with 4+ years of relevant experience.
• Demonstrated experience in equipment development and process integration for semiconductor packaging.
• Proficiency in statistical methods, experimental design, and data analysis.

Responsibilities

• Lead a team responsible for equipment development and semiconductor packaging solutions.
• Drive first-of-a-kind equipment introduction and smooth transition to high-volume manufacturing.
• Manage strategic and tactical decisions for module engineering activities.
• Collaborate with manufacturing, suppliers, and process integration teams to optimize equipment and processes.

Skills

Equipment development

Process integration

People management

Statistical methods

Education

Bachelor's degree in related field (Materials Science, Mechanical, Physics, Electrical, Chemical)

Master's degree in above fields

PhD in above fields

Job description

Intel Corporation is seeking a Packaging Equipment Development Manager to lead innovation in semiconductor packaging, oversee new equipment introductions, and drive seamless integration with manufacturing. The role sits within Assembly Technology Development, contributing to Intel's advanced packaging roadmap and high-volume production capabilities.

The position emphasizes leadership, strategic decision-making, and collaboration with internal and external partners to deliver cutting-edge