Advanced Packaging Research Engineer (Chiplets & 3DIC)

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 122,000 - 232,000; Full time

Benefits offered by this job

Health benefits

Stock bonuses

Hybrid work model

Retirement plan

Job summary

Intel Corporation is seeking a Semiconductor Packaging Research Engineer to drive advanced packaging research and heterogeneous integration concepts, including chiplets and 2.5D/3DIC. The role emphasizes evaluating architectures, materials, interconnects, reliability risks, and manufacturability trade-offs for future products.

The candidate will contribute to DOE, qualification evidence, and technology readiness while collaborating across research, design, and manufacturing teams.

Qualifications

• Master’s or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, Applied Physics, Computational Mechanics, Microelectronics, Semiconductor Manufacturing, or related field.

Responsibilities

• Research advanced packaging concepts such as chiplets, heterogeneous integration, 2.5D/3DIC, hybrid bonding, interposer, and die-to-die interconnects.
• Drive either process integration learning or modeling/simulation to assess feasibility, reliability, manufacturability, and technology readiness.
• For process integration: Define integration flows, research vehicles, DOE, defect/yield learning, qualification evidence, and risk mitigation paths.
• For modeling: Develop and validate thermal, thermo-mechanical, electrical, reliability, or multi-physics models using experimental and failure analysis data.
• Translate product needs into research hypotheses, technical plans, and recommendations; document outputs through reports, design guidance, IP, publications, and development-transfer inputs.
• Collaborate across research, design, process, materials, reliability, manufacturing, supplier, university, and ecosystem teams.

Skills

Semiconductor packaging research

Modeling/simulation

Reliability knowledge

Education

Master’s or Ph.D. in a relevant field

Tools

ANSYS

Abaqus

COMSOL

HFSS

Cadence

MATLAB

Python

JMP

Job description

Intel Corporation is seeking a Semiconductor Packaging Research Engineer to drive advanced packaging research and heterogeneous integration concepts, including chiplets and 2.5D/3DIC. The role emphasizes evaluating architectures, materials, interconnects, reliability risks, and manufacturability trade-offs for future products.

The candidate will contribute to DOE, qualification evidence, and technology readiness while collaborating across research, design, and manufacturing teams.