Senior IC Packaging Architect (FCBGA/SiP)

Ethernovia, Inc.; San Jose (CA); On-site; USD 200,000 - 265,000; Full time

Benefits offered by this job

Pre-IPO stock options

Flexible hours

Medical, dental and vision insurance

Job summary

Ethernovia, Inc. seeks a visionary Principal IC Package Design Engineer to lead architecture and execution of advanced packaging for next-gen Ethernet switches and PHYs.

You will own the package lifecycle from feasibility to mass production, collaborating with Silicon Design, Systems/PCB, and OSAT vendors. The role demands deep expertise in Flip-Chip BGA, SiP, and multi-chip modules, plus strong leadership and communication skills to drive cross-functional programs in a fast-growing hardware

Qualifications

• Bachelor of Science in EE/Materials/Mech or related field.
• 10+ years in IC package design and architecture.
• Experience with high-speed networking or automotive electronics preferred.

Responsibilities

• Package Architecture & Feasibility: Define concepts, stack-ups, bump maps, and pinouts for cost, electrical performance and thermal constraints.
• Detailed Package Design: Execute complex, high-speed multilayer layouts (FCBGA, FCCSP, SiP).
• SI/PI & Thermal Co-Design: Collaborate to meet high-speed SerDes, PDN and thermal targets.
• Substrate Design Integration: Define rules and manage layout, routing, manufacturing constraints.
• OSAT & Vendor Management: Engage with substrates and OSATs during NPI and production ramp.
• Cross-Functional Collaboration: Bridge Silicon IC Design and System/PCB teams for co-design.
• Technology Roadmap: Stay ahead on packaging trends to influence hardware roadmap.

Skills

Advanced Packaging

FCBGA

SiP

MCM

PDN/PI

Thermal management

Leadership

Education

B.S. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field

Tools

Cadence Allegro APD

SiP Layout

Synopsys 3DIC Compiler

Job description

Ethernovia, Inc. seeks a visionary Principal IC Package Design Engineer to lead architecture and execution of advanced packaging for next-gen Ethernet switches and PHYs.

You will own the package lifecycle from feasibility to mass production, collaborating with Silicon Design, Systems/PCB, and OSAT vendors. The role demands deep expertise in Flip-Chip BGA, SiP, and multi-chip modules, plus strong leadership and communication skills to drive cross-functional programs in a fast-growing hardware