Lead Advanced Packaging Engineer, 3DIC & Interposers

Synopsys Inc; Sunnyvale (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Synopsys Inc. seeks an experienced hardware packaging engineer to advance SIPI-centric silicon package designs.

You will work with cross-functional teams to optimize signal integrity and power integrity while delivering cutting-edge interposers and fanout packages. The role requires a decade of hands-on packaging experience, strong circuit theory, and proficiency with Cadence, Synopsys tools, and OSAT technologies.

Qualifications

• Bachelor’s degree in Electrical or Electronic Engineering is required; Master’s or PhD preferred.
• Minimum 10 years in advanced package design, model extraction, and analysis.
• Deep knowledge of advanced circuit and transmission line theory.
• Hands-on experience with leading semiconductor nodes and OSAT tech.

Responsibilities

• Collaborate with cross-functional teams to define SIPI performance requirements and power integrity.
• Design and develop advanced silicon package solutions (e.g., silicon interposers, RDL fanout, bridge packages).
• Model and analyze package designs for electrical, thermal, and mechanical performance.
• Present as technical leader on business unit projects and mentor peers.

Skills

Advanced packaging

Multi-physics analysis

Electrical engineering insight

Problem solving

Education

Bachelor's degree in Electrical or Electronic Engineering

Master’s or PhD preferred

Tools

Cadence APD

Innovus

Integrity-3DIC

Synopsys ICC2

3DIC Compiler

Fusion Compiler

Job description

Synopsys Inc. seeks an experienced hardware packaging engineer to advance SIPI-centric silicon package designs.

You will work with cross-functional teams to optimize signal integrity and power integrity while delivering cutting-edge interposers and fanout packages. The role requires a decade of hands-on packaging experience, strong circuit theory, and proficiency with Cadence, Synopsys tools, and OSAT technologies.