Lead IC Package Design Engineer - High-Speed Networking

Ethernovia; San Jose (CA); On-site; USD 180,000 - 260,000; Full time

Job summary

Ethernovia, Inc. in San Jose is seeking a Principal IC Package Design Engineer to lead the architecture, design, and execution of advanced packaging for our Ethernet switches and PHYs.

You will own the full package lifecycle from feasibility to mass production, collaborating with Silicon, PCB, and OSAT teams to meet high-speed SerDes targets and reliable automotive-grade requirements. Join a fast-growing team shaping the future of mobility with breakthrough packaging technology and

Qualifications

• Minimum of a B.S. in Electrical Engineering or related field.
• 10+ years in IC package design and architecture.
• Experience with high-speed networking or automotive electronics is preferred.

Responsibilities

• Lead package architecture & feasibility assessments for high-performance Ethernet switches and PHYs.
• Execute complex, multi-layer packages (FCBGA, SiP, MCM) with advanced stack-ups.
• Perform SI/PI and thermal co-design with Signal/Power Integrity and Thermal engineers.
• Define substrate design rules and manage routing, DFM/DFA constraints.
• Engage with OSATs and vendors for NPI and production ramp.
• Bridge Silicon IC Design and System/PCB teams for co-design optimization.
• Track and influence technology roadmap for advanced packaging trends.

Skills

High-speed packaging

SerDes knowledge

Cross-functional leadership

Data-driven decision making

Automotive electronics

Education

B.S. in Electrical Engineering

Tools

Cadence Allegro APD

SiP Layout

Synopsys 3DIC Compiler

HFSS

Q3D

Cadence Clarity

Job description

Ethernovia, Inc. in San Jose is seeking a Principal IC Package Design Engineer to lead the architecture, design, and execution of advanced packaging for our Ethernet switches and PHYs.

You will own the full package lifecycle from feasibility to mass production, collaborating with Silicon, PCB, and OSAT teams to meet high-speed SerDes targets and reliable automotive-grade requirements. Join a fast-growing team shaping the future of mobility with breakthrough packaging technology and