Senior HBM PDFA Engineer: Yield & Failure Analysis

Micron Technology; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Job summary

Micron Technology in Boise, Idaho is seeking an HBМ Product Yield Enhancement PDFA Engineer to drive failure analysis for next-generation HBM devices from design to mass production. You will focus on reliability and component-level improvement using electrical/physical characterization, AI tools, and statistics.

The role involves coordinating with Product, Process, Quality and Test Engineering teams to enable rapid ramp and time-to-market.

Qualifications

• 5+ years' experience in electrical and statistical failure analysis to understand failure mechanisms.
• 5+ years' experience applying electrical and physical characterization techniques.
• Proven analytical abilities with proficiency in statistical data analysis.
• Bachelor’s degree in Electrical/Computer Engineering, Physics, or Materials Science.

Responsibilities

• Perform electrical and statistical failure analysis to understand failure mechanisms.
• Identify causes of component failures through data analysis.
• Collaborate with partner engineering teams to resolve fabrication and assembly issues and test marginalities.
• Use AI tools (Claude, Copilot) and statistical methods for detailed data analysis to improve component performance.

Skills

Electrical failure analysis

Statistical data analysis

Data-driven decision making

Cross-functional collaboration

Education

Bachelor’s degree in Electrical/Computer Engineering, Physics, or Materials Science

Tools

JMP

Python

Claude

Copilot

Job description

Micron Technology in Boise, Idaho is seeking an HBМ Product Yield Enhancement PDFA Engineer to drive failure analysis for next-generation HBM devices from design to mass production. You will focus on reliability and component-level improvement using electrical/physical characterization, AI tools, and statistics.

The role involves coordinating with Product, Process, Quality and Test Engineering teams to enable rapid ramp and time-to-market.