HBM Failure Analysis Engineer - AI-Driven Yield

Micron Technology; Boise (ID); On-site; USD 100,000 - 140,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Vision plan

Paid time off

Paid holidays

Job summary

Micron Technology is seeking an HBM Product Yield Enhancement PDFA Engineer to drive reliability and failure analysis for next-generation HBM products from design to ramp. You will apply electrical, physical, and statistical techniques, plus AI-enabled data analysis, to identify failure mechanisms and optimize yield.

The role emphasizes cross-functional collaboration with Product, Process, Quality, and Test Engineering teams to resolve defects and support production ramp.

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Science, Physics, Materials Science, or related technical field.
• Experience in semiconductor device physics, manufacturing processes, or VLSI design.
• Demonstrated knowledge of statistical analysis techniques and data-driven problem solving.
• Experience using Python or similar programming languages for data analysis and engineering applications.
• Ability to analyze complex technical data and communicate findings effectively in a collaborative engineering environment.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify and understand component failure mechanisms.
• Analyze characterization and manufacturing data to determine root causes of fabrication, assembly, and test-related failures.
• Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process defect issues.
• Leverage AI-enabled tools and statistical methods to evaluate large datasets, identify trends, and improve component performance.
• Communicate findings, corrective actions, and risk assessments to multi-functional partners to support successful product qualification and production ramp.

Skills

Statistical analysis

Python data analysis

Data-driven problem solving

Engineering communication

Education

Bachelor's degree in Electrical Engineering, Computer Science, Physics, Materials Science, or related field

Master's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or related field

Tools

Python

AI tools

Statistical software

Job description

Micron Technology is seeking an HBM Product Yield Enhancement PDFA Engineer to drive reliability and failure analysis for next-generation HBM products from design to ramp. You will apply electrical, physical, and statistical techniques, plus AI-enabled data analysis, to identify failure mechanisms and optimize yield.

The role emphasizes cross-functional collaboration with Product, Process, Quality, and Test Engineering teams to resolve defects and support production ramp.