HBM Yield Enhancement & Failure Analysis Engineer

Micron Technology, Inc; Boise (ID); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off and holidays

Income protection & paid family leave

Job summary

Micron Technology, Inc. in Boise, Idaho, seeks a Level 2 or 3 HBM Product Yield Enhancement PDFA Engineer to drive failure analysis from design to mass production on the PDFA team.

You will perform electrical, physical, and statistical analyses to identify failure mechanisms and use AI-enabled tools to improve yield and reliability. You will collaborate with Product, Process, Test, Quality, and Manufacturing teams to resolve fabrication, assembly, and test-related issues, supporting rapid ramp

Qualifications

• Bachelor’s degree in a related field.
• 2+ years of experience performing electrical and statistical failure analysis.
• Experience applying electrical and physical characterization techniques for semiconductor failure analysis.
• Analytical and problem-solving skills with statistical methods.
• Experience using AI, machine learning, or data analytics tools for engineering analysis.
• Coursework in VLSI, semiconductor device physics, and Python.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify defect and failure mechanisms in HBM products.
• Analyze data to resolve root causes of failures using statistical methods and AI-enabled tools.
• Apply AI tools (e.g., Copilot, Claude) to enhance failure detection and yield.
• Collaborate with Product, Process, Test, Quality, and Manufacturing teams to resolve issues.
• Identify process defects and test-flow marginalities through data analysis.
• Communicate technical findings and drive corrective actions across teams.
• Support rapid production ramp and product qualification.

Skills

Electrical Engineering

Computer Engineering

Physics

Materials Science

Python programming

Statistics

AI / ML / data analytics

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field

Tools

Copilot

Claude

JMP

Job description

Micron Technology, Inc. in Boise, Idaho, seeks a Level 2 or 3 HBM Product Yield Enhancement PDFA Engineer to drive failure analysis from design to mass production on the PDFA team.

You will perform electrical, physical, and statistical analyses to identify failure mechanisms and use AI-enabled tools to improve yield and reliability. You will collaborate with Product, Process, Test, Quality, and Manufacturing teams to resolve fabrication, assembly, and test-related issues, supporting rapid ramp