HBM Product Failure Analysis Engineer – AI-Driven Yield

Micron Technology, Inc; Boise (ID); On-site; USD 120,000 - 160,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho, seeks a Staff HBM PYE Product Development Failure Analysis Engineer to drive next‑gen HBM devices from design to mass production.

You will apply electrical and physical characterization, data analysis, and AI-assisted tooling to identify failure mechanisms and drive improvements with cross‑functional teams. Responsibilities include failure analysis, root cause identification, collaboration with process and test engineering, and communicating results to

Qualifications

• 5+ years of experience using electrical and statistical failure analysis to understand failure mechanisms.
• 5+ years of experience in the application of electrical and physical characterization techniques.
• Proven experience applying statistical tools for analyzing data.

Responsibilities

• Perform electrical and statistical failure analysis to understand failure mechanisms.
• Identify causes of component failures through data analysis.
• Work closely with partner engineering teams to resolve fabrication and assembly process defect related issues and test flow marginalities.
• Using AI such as Claude and Copilot, as well as statistical tools, for detailed data analysis to improve component performance.

Skills

Electrical failure analysis

Statistical analysis

Python

Data analysis

Education

Bachelor's degree in Electrical or Computer Engineering, Physics, or Materials Science

Tools

JMP

Python

AI tools (Claude/Copilot)

Job description

Micron Technology, Inc. in Boise, Idaho, seeks a Staff HBM PYE Product Development Failure Analysis Engineer to drive next‑gen HBM devices from design to mass production.

You will apply electrical and physical characterization, data analysis, and AI-assisted tooling to identify failure mechanisms and drive improvements with cross‑functional teams. Responsibilities include failure analysis, root cause identification, collaboration with process and test engineering, and communicating results to