HBM Failure Analysis & Yield Engineer (AI-Driven)

Micron Technology, Inc; Boise, Northern (ID, KY); Hybrid; USD 70,000 - 100,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off and holidays

Relocation assistance TBD

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking a New College Grad HBM Product Development Failure Analysis Engineer to join the PDFA team, focusing on reliability and failure analysis for next-gen HBM products, using electrical, physical, and AI-assisted data analysis to drive rapid ramp.

The role collaborates with Product, Process, Quality, and Test Engineering, conducts statistical analysis, communicates findings, and supports product qualification and production ramp; requires strong

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Science, Physics, Materials Science, or related technical field or equivalent experience.
• Experience with semiconductor device physics, manufacturing processes, or VLSI design is preferred.
• Experience in data-driven problem solving and statistical analysis.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify failure mechanisms.
• Analyze characterization and manufacturing data to determine root causes of defects.
• Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield and reliability issues.
• Leverage AI-enabled tools and statistical methods to evaluate large datasets and identify trends.
• Communicate findings and corrective actions to multi-functional partners to support qualification and ramp.

Skills

Python programming

Statistical analysis

Data analysis

Communication

Education

Bachelor's degree in Electrical Engineering, Computer Science, Physics, Materials Science, or related technical field

Master's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or related field

Tools

Statistical software

Machine learning techniques

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking a New College Grad HBM Product Development Failure Analysis Engineer to join the PDFA team, focusing on reliability and failure analysis for next-gen HBM products, using electrical, physical, and AI-assisted data analysis to drive rapid ramp.

The role collaborates with Product, Process, Quality, and Test Engineering, conducts statistical analysis, communicates findings, and supports product qualification and production ramp; requires strong