AI-Driven HBM Yield & Failure Analysis Engineer

Micron Technology, Inc.

Boise (ID)

On-site

USD 90,000 - 130,000

Full time

14 days+
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Benefits offered by this job

Medical plans
Dental plans
Vision plans
Paid time off
Paid holidays

Job summary

Micron Technology, Inc. is seeking an HBM Product Yield Enhancement PDFA Engineer to drive reliability and yield for next-generation High Bandwidth Memory products.

You will apply electrical, physical, and statistical analysis, along with AI-enabled data techniques, to identify failure mechanisms and support rapid production ramp. You will partner with Product, Process, Quality, and Test Engineering to translate data into actionable improvements, ensuring robust product qualifications and

Qualifications

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related technical field, or equivalent experience.
  • Experience or coursework in semiconductor device physics, semiconductor manufacturing processes, or VLSI design.
  • Demonstrated knowledge of statistical analysis techniques and data-driven problem solving.
  • Experience using Python or similar programming languages for data analysis and engineering applications.
  • Ability to analyze complex technical data and communicate findings effectively in a collaborative engineering environment.

Responsibilities

  • Perform electrical, physical, and statistical failure analysis to identify and understand component failure mechanisms.
  • Analyze characterization and manufacturing data to determine root causes of fabrication, assembly, and test-related failures.
  • Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process defect issues.
  • Leverage AI-enabled tools and statistical methods to evaluate large datasets, identify trends, and improve component performance.
  • Communicate findings, corrective actions, and risk assessments to multi-functional partners to support successful product qualification and production ramp.

Skills

Python
Statistics
Data analysis
AI-enabled tools
Collaborative engineering

Education

Bachelor's degree in Electrical/Computer Engineering or related field

Tools

VLSI design
Semiconductor failure analysis

Job description

Micron Technology, Inc. is seeking an HBM Product Yield Enhancement PDFA Engineer to drive reliability and yield for next-generation High Bandwidth Memory products.

You will apply electrical, physical, and statistical analysis, along with AI-enabled data techniques, to identify failure mechanisms and support rapid production ramp. You will partner with Product, Process, Quality, and Test Engineering to translate data into actionable improvements, ensuring robust product qualifications and

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