HBM Yield Enhancement & Failure Analysis Engineer

Micron Technology; Boise (ID); On-site; USD 110,000 - 170,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off

Paid holidays

Job summary

Micron Technology in Boise, Idaho is seeking a Level 2 or 3 HBM PDFA Engineer to drive failure analysis from design through mass production. You will apply electrical, physical, and statistical techniques to characterize failures and identify root causes, partnering with Product, Process, Test, Quality, and Manufacturing teams.

You will leverage AI-enabled tools to improve failure detection, reliability learning cycles, and yield, supporting rapid ramp and qualification efforts.

Qualifications

• Bachelor's degree in a relevant engineering/physics field.
• 2+ years electrical and statistical failure analysis experience.
• 2+ years applying electrical/physical characterization techniques for semiconductor failure analysis.
• Experience using AI, ML, or data analytics tools for engineering analysis.
• Coursework in VLSI, semiconductor device physics, semiconductor processing, Python, and statistics.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify and understand defect and failure mechanisms in HBM products.
• Analyze component- and system-level data to resolve root causes of failures using statistics, engineering methods, and AI-enabled tools.
• Apply AI tools and analytics to enhance detection, reliability learning cycles, and yield improvement.
• Collaborate with Product, Process, Test, Quality, and Manufacturing Engineering teams to resolve fabrication, assembly, and test-related issues.
• Identify process defects, assembly-related failures, and test flow marginalities through data analysis and characterization.
• Communicate findings, recommendations, and corrective actions to team members and drive issue resolution across functions.
• Support rapid production ramp, product qualification, and continuous reliability improvement initiatives.

Skills

Electrical failure analysis

Statistical failure analysis

AI tools for data analysis

Python programming

Statistics

VLSI concepts

Semiconductor device physics

Semiconductor processing

Communication skills

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or related field

Tools

JMP

Copilot

Claude

Job description

Micron Technology in Boise, Idaho is seeking a Level 2 or 3 HBM PDFA Engineer to drive failure analysis from design through mass production. You will apply electrical, physical, and statistical techniques to characterize failures and identify root causes, partnering with Product, Process, Test, Quality, and Manufacturing teams.

You will leverage AI-enabled tools to improve failure detection, reliability learning cycles, and yield, supporting rapid ramp and qualification efforts.