HBM PDFA Engineer: AI-Driven Yield & Failure Analysis

Micron

Boise (ID)

On-site

USD 110,000 - 170,000

Full time

14 days+

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Job summary

Micron Technology in Boise, Idaho seeks an HBM Product Yield Enhancement PDFA Engineer to drive next‑gen HBM devices from design to mass production. You will apply electrical/physical characterization, data analysis, and AI‑driven insights to identify failure mechanisms and coordinate improvements across cross‑functional teams.

Ideal candidates have 5+ years in electrical and statistical failure analysis, strong experience with characterization techniques, and a Bachelor’s degree in

Qualifications

5+ years of experience applying electrical and statistical failure analysis to identify failure mechanisms.
5+ years applying electrical and physical characterization techniques with data-driven insight.
Bachelor’s degree in Electrical/Computer Engineering, Physics, or Materials Science required.

Responsibilities

Perform electrical and statistical failure analysis to understand failure mechanisms.
Identify causes of component failures through data analysis and cross‑functional collaboration.
Coordinate with Product, Process, Quality and Test Engineering to resolve defects.
Apply AI and statistical tools to improve component performance and yield.

Skills

Electrical failure analysis

Statistical data analysis

Electrical characterization techniques

Physical characterization techniques

Education

Bachelor’s degree in Electrical or Computer Engineering, Physics, or Materials Science

Tools

JMP

Python

AI tools (Claude, Copilot)

Statistical software

Job description

Ideal candidates have 5+ years in electrical and statistical failure analysis, strong experience with characterization techniques, and a Bachelor’s degree in

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