HBM AI-Enabled Failure & Yield Analysis Engineer

Micron Technology, Inc; Boise, Northern (ID, KY); Hybrid; USD 90,000 - 130,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho seeks a Staff HBM Product Development Failure Analysis Engineer to lead electrical and physical failure analysis for next-gen HBM devices from design to mass production.

You will analyze failure mechanisms, communicate findings to Product, Process, Quality and Test teams, and apply AI tools for data-driven improvements, driving rapid ramp and time-to-market.

Qualifications

• 5+ years of experience using electrical and statistical failure analysis to understand failure mechanisms.
• 5+ years of experience in the application of electrical and physical characterization techniques.
• Bachelor’s degree in Electrical or Computer Engineering, Physics, or Materials Science.

Responsibilities

• Perform electrical and statistical failure analysis to understand failure mechanisms.
• Identify causes of component failures through data analysis.
• Work with partner engineering teams to resolve fabrication and assembly process defect issues and test-flow marginalities.
• Use AI tools and statistical software for detailed data analysis to improve component performance.

Skills

Electrical failure analysis

Statistical data analysis

Python

AI tools (Claude/Copilot)

Education

Bachelor’s degree in Electrical or Computer Engineering, Physics, or Materials Science

Tools

Claude

Copilot

JMP

Python

Job description

Micron Technology, Inc. in Boise, Idaho seeks a Staff HBM Product Development Failure Analysis Engineer to lead electrical and physical failure analysis for next-gen HBM devices from design to mass production.

You will analyze failure mechanisms, communicate findings to Product, Process, Quality and Test teams, and apply AI tools for data-driven improvements, driving rapid ramp and time-to-market.