HBM Failure Analysis Engineer - Product Dev & AI Yield

Micron Technology, Inc; Boise (ID); On-site; USD 85,000 - 125,000; Full time

Benefits offered by this job

Benefits package

Relocation TBD

Job summary

Micron Technology, Inc in Boise, Idaho is seeking a New College Grad - HBM PDFA Engineer to join the Product Development Failure Analysis team. You will apply electrical characterization, physical analysis, and AI-enabled data tools to identify failure mechanisms and support rapid production ramp.

This entry-level role offers exposure to cross-functional collaboration with Product, Process, Quality, and Test Engineering, plus opportunities to contribute to next-generation HBM devices and

Qualifications

• Bachelor's degree in a technical field is required.
• Experience or coursework in semiconductor device physics, manufacturing processes, or VLSI design is required.
• Proven knowledge of statistical analysis techniques and data-driven problem solving.
• Experience using Python or similar programming languages for data analysis.
• Ability to analyze complex technical data and communicate findings in a collaborative engineering environment.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify failure mechanisms.
• Analyze characterization and manufacturing data to determine root causes of failures.
• Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield and reliability issues.
• Leverage AI-enabled tools and statistical methods to evaluate large datasets and identify trends.
• Communicate findings and corrective actions to support product qualification and ramp.

Skills

Statistical analysis

Data analysis

AI-enabled data tools

Electrical engineering fundamentals

Semiconductor knowledge

Education

Bachelor's degree in Electrical Engineering, Computer Science, Physics, or related field

Master's degree in Electrical Engineering, Computer Engineering, Physics, or related field

Tools

Python

Job description

Micron Technology, Inc in Boise, Idaho is seeking a New College Grad - HBM PDFA Engineer to join the Product Development Failure Analysis team. You will apply electrical characterization, physical analysis, and AI-enabled data tools to identify failure mechanisms and support rapid production ramp.

This entry-level role offers exposure to cross-functional collaboration with Product, Process, Quality, and Test Engineering, plus opportunities to contribute to next-generation HBM devices and